Substrate etching, lamination processing
Supports one-sided processing up to approximately 2.0mm! In composite processing, the taper of the cross-section is suppressed. Irregular shapes can also be reproduced.
Our company's "substrate etching and lamination processing" can accommodate single-sided processing up to approximately 2.0mm. In composite processing, the taper of the cross-section is suppressed. Irregular shapes can also be reproduced. The thickness of the material can be increased further (consultation required). 【Processing Capabilities】 ■ Single-sided etching ■ Double-sided etching ■ Composite processing etching + α *For more details, please refer to the PDF document or feel free to contact us.
- Company：平井精密工業
- Price：Other
